| Sr | Specifications | Standard | |
|---|---|---|---|
| 1. | Minimum conductor width | 6 mils( 0.15 mm) | |
| 2. | Minimum conductor Spacing/Air gap | 6 mils( 0.15 mm) | |
| 3. | Minimum Plated hole size | 16 mils( 0.4mm) | |
| 4. | Maximum Plated hole size | 240 mils( 6mm) | |
| 5. | Maximum board size | 300 mm x 350 mm | |
| 6. | Maximum number of layers | 2 | |
| 7. | Minimum copper thickness | 1 Oz (35 microns) | |
| 8. | Maximum copper thickness | 3 Oz (105 microns) | |
| 9. | Dedicated Electrical Testing (BBT) | Available | |
| 10. | PCB Cutting options | Maximum copper thickness | |
| Sr | Specifications | Standard | |
|---|---|---|---|
| 1. | Single Sided | HAL, Lacquer | |
| 2. | Double Sided | HAL , TIN, Electroplated Gold & Nickel | |
| 3. | Solder Mask Finish | PISM, Liquid Solder Mask | |
| 4. | Solder Mask color | Green, White, Black, Blue ,Red | |
| 5. | Legend/Ident color | White, Black, yellow, Green | |
| 6. | Special Requirement | Carbon Printing on Push Button , Selective Gold & Nickel plating on Connecting Tabs | |
| Sr | Specifications | Standard | |
|---|---|---|---|
| 1. | Single Side | FR1,FR4, CEM1,CEM3, PP, Metal Clad | |
| 2. | Double Side | FR4 | |
| 3. | Board Thickness (in mm) | 0.4 , 0.8 ,1.0 , 1.2, 1.6 ,2.4 , 3.2 | |
