CircuitWala always thinks in way to increase own strength to serve customer better and best Products!
CircuitWala always thinks in way to increase own strength to serve customer better and best Products!
Sr | Specifications | Value | |
---|---|---|---|
1. | Max. no. of layers | 2 | |
2. | Max. board size (L x W) in mm. | 380 x 280 | |
3. | Max. board thickness (in mm.) | 3.20 mm | |
4. | Min. finished board thickness (in mm.) | 0.80 mm |
Sr | Specifications | Value | |
---|---|---|---|
1. | Base Material | FR4 | |
2. | Inner layer Copper cladding | ||
* Max. Cu Wt. For Planes (Oz.) | 2 | ||
* Max. Cu Wt. For Signals (Oz.) | 2 | ||
* Min. Cu Wt. (Oz.) | 0.5 | ||
3. | Outer layer Copper cladding | ||
*Max Cu Wt. (Oz.) | 3 | ||
*Min Cu Wt. (Oz.) | 0.5 |
Sr | Specification | Value | |
---|---|---|---|
1. | For Start copper thickness of 0.5 Oz. | Min track width | 0.125 mm |
Min. Spacing | 0.125 mm | ||
2. | For Start copper thickness of 1.0 Oz. | Min track width | 0.15 |
Min. Spacing | 0.15 | ||
3. | For Start copper thickness of 2.0 Oz. | Min track width | 0.175 |
Min. Spacing | 0.2 |
Sr | Specification | Value | |
---|---|---|---|
1. | Min. finished via hole size (Tool dia) | 0.5 mm | |
2. | Min. finished via pad size | 0.5 mm | |
3. | Min. annular ring | 0.15 mm | |
4. | Drill to drill clearance | 0.15 mm | |
5. | Min. slot size for PTH slots (Tool size) | 0.8 mm | |
6. | Blind & Buried vias manufacturable | YES | |
7. | Drill to track clearance for Inner layers (upto 6 layer) | 0.275 mm | |
Drill to track clearance for Inner layers (>6 layer) | 0.35 mm | ||
8. | Min. drill size for plated holes on board edge | 0.80 mm | |
9. | Min. drill to drill clearance for plated holes on board edge | 0.80 mm | |
10. | Any special angle for Counter sunk | Not Possible |
Sr | Specification | Value | |
---|---|---|---|
1. | HASL (Lead free & PB/Sn both) | YES | |
2. | Electrolytic Gold | YES | |
3. | Electroless Nickle / Gold | YES | |
4. | Immersion Silver | YES | |
5. | Immersion Tin | YES | |
6. | SMOBC with OSP | YES | |
7. | Selective Gold | Not Possible |
Sr | Specification | Value | |
---|---|---|---|
1. | Min. core thickness | 0.15 mm | |
2. | Min. possible dielectric thickness | 0.15 mm | |
3. | Sequential buildup | Not Possible | |
4. | Controlled Impedance merasurement | YES |
Sr | Specification | Value | |
---|---|---|---|
1. | Mask opening | Green masking | 0.10 mm |
2. | Min. soldermask web width between pads | 0.10 mm | |
3. | Mask opening | Other than Green | 0.120 mm |
4. | Min. soldermask web width between pads | 0.120 mm | |
5. | SM to trace clearance | 0.10 mm | |
6. | Via fill max drill size | 0.40 mm |
Sr | Specification | Value | |
---|---|---|---|
1. | Legend line width | 0.15 mm to 0.20 mm | |
2. | Min. character height | 1.00 mm |
Sr | Specification | Value | |
---|---|---|---|
1. | Angle for v-cut | 30 degree | |
2. | Jump scoring | Yes |
Sr | Specification | Value | |
---|---|---|---|
1. | Min. router size | 0.80 mm | |
2. | Depth routing | Not possible | |
3. | Any special tolerances for Chamfering | Not possible |
Sr | Specification | Value | |
---|---|---|---|
1. | For routing | 0.25 mm | |
2. | For scoring | 0.45 mm | |
3. | For inner layer | 0.4 mm |
Sr | Specification | Value | |
---|---|---|---|
1. | Min. line width | 0.30 mm | |
2. | Min. carbon – carbon spacing | 0.25 mm |
Sr | Specification | Value | |
---|---|---|---|
1. | Minimum width of any Peel-off element | 0.50 mm | |
2. | Maximum coverable hole ENDSIZE | 6.00 mm | |
3. | Minimum overlap on copper pattern | 0.254 mm | |
4. | Minimum clearance to free copper | 0.254 mm | |
5. | Minimum distance from PCB outline | 0.50 mm |
PTH Hole Size | PTH Tolerance | NPTH Hole Size | NPTH Tolerance |
---|---|---|---|
0.50-3.50 mm | +/- 0.10 mm | <3 mm | +/- 0.10 mm |
>3.50 mm | +/- 0.15mm | >3 mm | +/- 0.15 mm |
PCB Size | +/- 0.20 mm |
PCB Thickness | +/- 0.10 % |
Trace Width / Spacing | +/- 0.20 % |
Copper Thickness Inside Hole | >= 0.20 um |
Bow & twist tolerance | +/- 1% |
ROHS Compliances finishes :
Non-ROHS Finish :