Technical Capabilities | Circuitwala

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Technical Capabilities

Sr	Specifications		Value
1.	Max. no. of layers		2
2.	Max. board size (L x W) in mm.		380 x 280
3.	Max. board thickness (in mm.)		3.20 mm
4.	Min. finished board thickness (in mm.)		0.80 mm

Base Material

Sr	Specifications		Value
1.	Base Material		FR4
2.	Inner layer Copper cladding
	* Max. Cu Wt. For Planes (Oz.)		2
	* Max. Cu Wt. For Signals (Oz.)		2
	* Min. Cu Wt. (Oz.)		0.5
3.	Outer layer Copper cladding
	*Max Cu Wt. (Oz.)		3
	*Min Cu Wt. (Oz.)		0.5

Circuit Layers (Minimum capabilities in mm)

Sr	Specification		Value
1.	For Start copper thickness of 0.5 Oz.	Min track width	0.125 mm
		Min. Spacing	0.125 mm
2.	For Start copper thickness of 1.0 Oz.	Min track width	0.15
		Min. Spacing	0.15
3.	For Start copper thickness of 2.0 Oz.	Min track width	0.175
		Min. Spacing	0.2

Drilling

Sr	Specification		Value
1.	Min. finished via hole size (Tool dia)		0.5 mm
2.	Min. finished via pad size		0.5 mm
3.	Min. annular ring		0.15 mm
4.	Drill to drill clearance		0.15 mm
5.	Min. slot size for PTH slots (Tool size)		0.8 mm
6.	Blind & Buried vias manufacturable		YES
7.	Drill to track clearance for Inner layers (upto 6 layer)		0.275 mm
	Drill to track clearance for Inner layers (>6 layer)		0.35 mm
8.	Min. drill size for plated holes on board edge		0.80 mm
9.	Min. drill to drill clearance for plated holes on board edge		0.80 mm
10.	Any special angle for Counter sunk		Not Possible

Surface Finish

Sr	Specification		Value
1.	HASL (Lead free & PB/Sn both)		YES
2.	Electrolytic Gold		YES
3.	Electroless Nickle / Gold		YES
4.	Immersion Silver		YES
5.	Immersion Tin		YES
6.	SMOBC with OSP		YES
7.	Selective Gold		Not Possible

Layer construction & Impedance Design

Sr	Specification		Value
1.	Min. core thickness		0.15 mm
2.	Min. possible dielectric thickness		0.15 mm
3.	Sequential buildup		Not Possible
4.	Controlled Impedance merasurement		YES

Solder Mask

Sr	Specification		Value
1.	Mask opening	Green masking	0.10 mm
2.	Min. soldermask web width between pads		0.10 mm
3.	Mask opening	Other than Green	0.120 mm
4.	Min. soldermask web width between pads		0.120 mm
5.	SM to trace clearance		0.10 mm
6.	Via fill max drill size		0.40 mm

Legend

Sr	Specification		Value
1.	Legend line width		0.15 mm to 0.20 mm
2.	Min. character height		1.00 mm

Scoring

Sr	Specification		Value
1.	Angle for v-cut		30 degree
2.	Jump scoring		Yes

Routing

Sr	Specification		Value
1.	Min. router size		0.80 mm
2.	Depth routing		Not possible
3.	Any special tolerances for Chamfering		Not possible

Copper Clearance from PCB Edge

Sr	Specification		Value
1.	For routing		0.25 mm
2.	For scoring		0.45 mm
3.	For inner layer		0.4 mm

Carbon

Sr	Specification		Value
1.	Min. line width		0.30 mm
2.	Min. carbon – carbon spacing		0.25 mm

Peelable

Sr	Specification		Value
1.	Minimum width of any Peel-off element		0.50 mm
2.	Maximum coverable hole ENDSIZE		6.00 mm
3.	Minimum overlap on copper pattern		0.254 mm
4.	Minimum clearance to free copper		0.254 mm
5.	Minimum distance from PCB outline		0.50 mm

Drill Tolerances

PTH Hole Size	PTH Tolerance	NPTH Hole Size	NPTH Tolerance
0.50-3.50 mm	+/- 0.10 mm	<3 mm	+/- 0.10 mm
>3.50 mm	+/- 0.15mm	>3 mm	+/- 0.15 mm

Other Tolerances

PCB Size	+/- 0.20 mm
PCB Thickness	+/- 0.10 %
Trace Width / Spacing	+/- 0.20 %
Copper Thickness Inside Hole	>= 0.20 um
Bow & twist tolerance	+/- 1%

Available Finishes

ROHS Compliances finishes :

Non-ROHS Finish :

Solder Mask Colours

Legend Colours

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